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Himfr.com Reports Ibm Will Join In China's Fab, Tsmc, To Contend For Technical Cooperation

Himfr.com Reports Ibm Will Join In China's Fab, Tsmc, To Contend For Technical Cooperation

Recent IBM big moves start with the mainland, foundry technology platform cooperation

, not only to join hands with SMIC's advanced 45-nanometer manufacturing process, but also with the Wuxi CSMC an alliance against the mainstream 0.18-micron RF CMOS process technology and process orders for co-operation. China noted that the semiconductor industry, IBM actively use mainland-fab productivity, the full expansion of the mainland market is expected to influence the future of IBM technology, deep plowing in the mainland, and to compete with TSMC forces.

Mainland China semiconductor industry said that the current IBM technology licensing for the field to take a more proactive approach, especially for urgent assistance to the continent Austrian technology platform fab, IBM actively seek opportunities for cooperation, not only for technology licensing rather open, not even rule out the way, some originally IBM, under a single customer, go to the mainland through the IBM fab to foundry, highlighting the semiconductor manufacturing process technology platform, IBM intends to round deep plowing in the mainland market through a broad alliance, the semiconductor market in China up some big flag IBM technology platform.

In fact, most of the past, China fab no sources of technology umbrella, in the absence of intellectual property rights protection, it often occurs with large-scale wafer intellectual property disputes, like SMIC and TSMC have dragged on since the past the so-called class Taiwan Semiconductor Manufacturing Company (TSMC-like) processes are also quite controversial, so many mainland Chinese foundry Taiwan Semiconductor Manufacturing Company intends to change the orientation process line, switched to a more open attitude towards the current IBM technology platform.

The semiconductor industry that the China fab eco-change will occur, and to promote IBM and TSMC technology platform in the mainland market forces and changes occur gradually, the current IBM technology forces in the continent is rapidly infiltrated in advanced manufacturing processes, IBM has SMIC co-45-nm manufacturing process, the fastest mass production in 2010, the future does not rule out the two sides continue to move forward towards the 32-nanometer manufacturing process; process in mainstream areas, IBM has selected cooperation partners, and Wuxi CSMC 0.18 micron in cooperation with IBM RF CMOS process technology, has an initial deployment of about 20000 8-inch wafer production capacity to provide some IBM customers and its own customers use. Himfr.com Reports Ibm Will Join In China's Fab, Tsmc, To Contend For Technical Cooperation


The semiconductor industry, pointed out that CSMC is the continent's first to a process authorized by IBM to achieve mainstream semiconductor industry, the fastest in 2010 in the test-volume production, the future of the two sides will continue to develop 0.18-micron away from cooperation. CSMC is currently a single six-inch wafer fabs to 90000 per month in the next 8-inch plant will gradually expand production capacity to 60000. In addition, CSMC the past and the Singapore-based Chartered (Chartered) has Ownership and OEM relationships with IBM technology licensing to join camp, CSMC collaboration with IBM is also tracked.

by: stefasuan
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