Himfr Reports Global Semiconductor Market With A Good 5 Years
According to Taiwan media, Taiwan's leading foundry Taiwan Semiconductor Manufacturing
Company yesterday (14) days annual technology forum held in the U.S., Chairman Morris Chang said that the global semiconductor market this year and next are the healthy growth from 2011 to 2014 showed a moderate growth compound annual growth rate of 4.2%.
Chang also said the semiconductor industry needs more cooperation, and back in before the start of chip design must cooperate to effectively reduce costs, TSMC 20 nm, 14 nm, 10 nm advanced process research and development will not be absent.
As the semiconductor market economy to recover and TSMC annual technology forum attracted nearly 1,800 representatives of customers or partners, while Chang was at the speech for the next five years, the semiconductor market economy, Taiwan Semiconductor Manufacturing industry position, and facing the future of the semiconductor market challenges their views.
Chang said that this year's Annual Changes the global semiconductor market will reach 22%, the scale will reach 276 billion U.S. dollars, next year will further grow 7% this year and next year's growth is very healthy, but from 2011 to 2014 will show a moderate growth of between The annual compound growth rate of 4.2% for the IC design industry can achieve 7.2% growth rate.
The modest growth in 2011 after the market reason, including the number of semiconductor built-S curve has reached the high point of the natural slow growth; and electronic product sales focus from the business side to consumption side, by the developed countries transferred to developing countries , the average price continues to decline. In addition, non-semiconductor components of electronic products accounted for the increase in costs, enhance the level of chip integration, electronic products were built leading to the decline in the total number of chips; As for slowing down the development of Moore's Law is one of the important reasons.
Chang said that TSMC capital spending this year to 4.8 billion overweight purpose is to provide customers with an effective capacity, and in addition to money, we also have some talent, the TSMC staff late last year about 2 million, now has increased to 2.5 million by the end of increase to 2.9 million, and over the past five years, the R & D increased by 3 times, getting back together has been semi-retired Jiang Shangyi back any research and development senior vice president, and another Fu-Chieh Hsu, a vice president with leading R & D team, now 28, has done almost nanometer, 20 nanometer is about to start R & D, followed by 14 nm, 10 nm generation, TSMC will not be absent.
Chang also proposed a future industry will face challenges. He said that four years ago at the IEEE meeting, mentioned that foundries co-operation with customers is to start co-operation from design, but it is necessary to design before the start of cooperation, both sides if some functions good choice, it can save a lot of cost.
Chang pointed out that such cooperation include trade-offs between power consumption and performance, design structure and number of transistors on a choice, because the chip is not every block needs to quickly transistor, if completed before the design trade-offs, the cost can lower power consumption will be superior. As for the latter part of the IC packaging and testing and system design also needs to be completed before the design can solve many manufacturing difficulties.
by: stefasuan
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